.gif){kind=spacer}
| Overview |
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where 'systems' used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges. |
| About the authors |
Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the US for improving national competitiveness. |
| Table of contents |
Chapter 1. Introduction to the System-on-Package (SOP) Technology Chapter 2. Introduction to System-on-Chip (SOC) Chapter 3. Stacked ICs and Packages (SIP) Chapter 4. Mixed-Signal (SOP) Design Chapter 5. Radio Frequency System-on-Package (RF SOP) Chapter 6. Integrated Chip-to-Chip Optoelectronic SOP Chapter 7. SOP Substrate with Multilayer Wiring and Thin-Film Embedded Components Chapter 8. Mixed-Signal Reliability Chapter 9. MEMS Packaging Chapter 10. Wafer-Level SOP Chapter 11. Thermal SOP Chapter 12. Electrical Test of SOP Modules and Systems Chapter 13. Biosensor SOP Index |
